奈米工程與微系統研究所　書報討論

Seminar of Inst. NanoEngineering and MicroSystems

Ryan Lai(賴律名)

Advanced Semiconductor Engineering, Inc. / director

日月光處長

Establish the means of sensor packaging

Abstract:

Sensor versatile applications geared towards IoE. The grows across the expanding range of mobile, wearable, smart living, robot and automotive. Innovative portfolio to fulfill diversified market demands on IMU, identification, health assurance, environmental sensing, autonomous car are running within very tight time. Standardization seems not to be suitable for burgeoning industry. Also a platform of heterogeneous integration needs to be showcased.

15:30-17:20 on Sep. 30(Mon), 2019 at Room 108 of Eng. Building I

Host：Prof. Mei-Feng Lai mflai@mx.nthu.edu.tw Ext:33998

Contact：Ming-Wei Wang cenawang0216@gmail.com