奈米工程與微系統研究所　書報討論

Seminar of Inst. NanoEngineering and MicroSystems

Speech I. Ho-Chiao Chuang

Department of Mechanical Engineering

National Taipei University of Technology, Taiwan

Professor

Title: Tracking and compensation of respiration pattern by an automatic compensation system.

Abstract

This study aimed to determine the feasibility of using an ultrasound image tracking algorithm(UITA) combined with a respiration compensating system(RCS) to track and compensate the respiration pattern of the diaphragm in real time.

Diaphragm motions and various baseline-shift signals were tracked and captured in volunteers using our previously developed UITA. A diaphragm phantom was placed on a respiration simulation system(RSS) that received signals with different patterns of baseline-shift signals to simulate actual human baseline-shift signals. The RSS was mounted on the RCS, which is 180 cm long and driven by inputting a compensating signal to a linear actuator underneath with and without using a phase-lead compensator(PLC). The target displacement was calculated automatically by the UITA and compensated by the RCS. The phantom displacements were observed using a fluoroscopic imaging system on the linear accelerator at the Department of Radiation Oncology, Taipei Medical University Hospital, and the results were also compared with the displacements measured by the UITA and the RSS for correlation verification. In addition, the compensating effect was analyzed after activating the RCS.

Brief Biography

Ho-Chiao Chuang earned a B.S. in mechanical engineering at Da-Yeh University, Taiwan, in 2000 and a M.S. in the Department of Power Mechanical Engineering at National Tsing-Hua University, Taiwan, in 2002. He joined Professor Victor Bright’s MEMS group in 2004 and earned his Ph.D. in 2008 from the Department of Mechanical Engineering at the University of Colorado at Boulder, USA. He joined Dept. of Mechanical Engineering, National Taipei University of Technology, Taiwan, since 2009.02. His current research interests include the fabrication of through silicon vias(TSV) for 3D IC, ultra-high aspect ratio of the TSV by using the supercritical CO2 electroplating process, the development of new biomedical instruments especially in the aspect of counteraction treatment couch for respiration-induced tumor motion, and development of novel energy saving technology for different application fields.

15:30-17:20 on May 13(Mon), 2019 at Room 108 of Eng. Building I

Host：Prof. J.Andrew Yeh jayeh@mx.nthu.edu.tw Ext:42912

Contact：Yu-Chen Lin(RA) s8317947@gmail.com