奈米工程與微系統研究所　書報討論

Seminar of Inst. NanoEngineering and MicroSystems

郭文正 博士

Wen-Cheng Kuo

The research and development of 3D system integration and package for flexible wireless biomedical application

2016年10月31日(週一)，1530－1720，工程一館108室

1530-1720 on Oct. 31 (Mon.), 2016 in Room 108 of Eng. Building I

Abstract

The research is to develop a flexible wireless biomedical system by integrating 3D system with packaging technology. The system can be attached to the skin or implanted in a body. The system uses 3D IC package concepts for integrating the chip and passive components to form the bio-compatible wireless biomedical system. The process uses thicker gold foil as coil, micro-machined by the pico-second laser so that the quality factor can be higher. In consideration of system integration, parylene is used as the flexible substrate, and the contact pads and connections between the coil and the chip are created by gold deposition. The accelerated-lifetime-soaking-testing is also discussed in the research. The system can be used for batteryless wearable ECG monitoring system and the blood oxygen sensing for oral appliance/wearable devices.

Contact: Wei-Chih Wang (03-5742488)

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